公司简介: 深圳市海思半导体有限公司HiSilicon is a global leading fabless semiconductor and IC design company that is dedicated to providing comprehensive connectivity and multimedia chipset solutions. As a prominent industry leader, HiSilicon paves the way for innovations in global connectivity and end-to-end ultra-HD video technologies.From high-speed communications, smart devices, and IoT to video applications, HiSilicon chipsets and solutions have been proven and certified in more than 100 countries and regions in the world:For wireless communications, technology leadership is a tremendous achievement and it is mainly contributed by the company’s pursuit of innovations. This includes the successful launch of Balong modems with LTE Cat.4, Cat.6, Cat.12/13, Cat.18, Cat.19, Cat.21, dual SIM & dual LTE (with VoLTE), and pseudo-base-station defense technologies ahead of other providers. HiSilicon is the first to commercialize 5G wireless chipsets to promote the 5G industry development.For smart devices, HiSilicon’s Kirin SoCs provide high-performance, high-power-efficiency, and ultra-intelligent mobile AI solutions to create a superior user experience.For data centers, HiSilicon develops Kunpeng series server CPU processors based on the ARM architecture. With outstanding performance, throughput, integration, and energy efficiency, Kunpeng series processors apply in a wide range of scenarios such as big data, distributed storage, ARM native application, meeting diversified computing requirements of data centers.For AI applications, HiSilicon provides all-scenario AI chipset Ascend series SoC to extend AI from the data center to the edge and device, offering AI computing power towards data center, edge, consumer device and IoT scenarios, also provides brand-new solutions for the innovative use cases such as safety city, self-driving, cloud service, IT intelligence, smart manufacturing, and robots to accelerate the implementation of AI in each domain.For video applications, HiSilicon has launched the world’s leading chips for smart IP cameras, smart STBs, and smart TVs, providing end-to-end full 8K/4K products and solutions that focus on image recording, decoding, and display.For IoT applications, HiSilicon has launched PLC/G.hn/Connectivity/NB-IoT products to build a network of reliable and secure channels that serve to connect digital devices in each home and in a variety of industry.Headquartered in Shenzhen, China, HiSilicon has over 7,000 employees in offices and research centers in Beijing, Shanghai, Chengdu, Wuhan, Singapore, South Korea, Japan, Europe and other regions across the world. After 20 years of research and development, HiSilicon has built up a strong portfolio of IC design and verification technologies, developed an advanced EDA design platform, and is responsible for the set up of several development processes and regulations. Over the years, HiSilicon has successfully developed more than 200 Models with proprietary IPR and filed over 8,000 patents. HiSilicon has also established strategic partnerships with global leaders in the ecosystem, specifically for engineering (wafer manufacturing), packaging, and testing within a reliable supply chain.The mission of HiSilicon is to provide the best-quality solutions and services with a prompt response to the customers – HiSilicon is customer-centric and is committed to value creation for the customers.
新闻动态
中兴通讯130亿元定增项目获证监会批复
随着全球5G商用进程的加速、电信基础设施升级,中兴通讯亟需在5G网络演进的关键时期继续加大对技术研究与产品开发投入力度。为此,2018年1月31日,中兴通讯曾发布非公开发行预案,
德克威尔 x 上海工博会!远程I/O在智能制造中的前瞻性应用
德克威尔将携多款远程I/O及阀岛前往展会,为大家带来汽车、3C、半导体、物流、包装等多个高端制造领域的智能化、高品质、差异化的自动化应用解决方案!
特色园区推动集成电路产业加速发展
2020年疫情席卷全球,对各行各业都产生了或大或小的影响,集成电路产业也不例外。国家首次提出新基建政策,大大助力了中国集成电路产业的发展。新基建三个方面都与科技创新密切
金泰克亮相日本IT Week Spring展会 ——旗舰新品G6水冷SSD备受瞩目
金泰克参展团队为来宾们展示了多款电竞级、工控级、企业级、嵌入式和消费级产品。
深耕传感器领域,纳芯微携丰富的传感器产品解决方案参加Sensor China 2023
在9月13日举办的2023中国传感器产业之夜晚宴暨颁奖盛典上,纳芯微荣获Sensor China主办方颁发的“年度感知力量”奖项。